Primer for HP Indigo Presses | Dscoop Asia | Dscoop EMEA

Wednesday, 28 May 2014


Michelman Featuring Two New DigiPrime Primers Optimized for HP Indigo 20000 and Indigo 30000 Digital Presses at Dscoop Asia and Dscoop EMEA 2014

CINCINNATI, OH (May 28, 2014) – Michelman will be featuring two new HP-recommended DigiPrime® primers formulated for the HP Indigo 20000 and 30000 digital presses at Dscoop Asia being held June 12-13, 2014 in Bali, Indonesia and at Dscoop EMEA being held June 25-27, 2014 in Budapest, Hungary. Michelman will be exhibiting in F21 at Dscoop Asia and as a King Partner at Dscoop EMEA.

DigiPrime 050 is a new primer formulated for the HP Indigo 20000, a press designed to print on reel-based flexible packaging substrates, labels and shrink sleeves. Michelman’s primer is designed to enhance adhesive bond strength between film layers, and can be used on conventional adhesive laminated structures.

DigiPrime 060 is formulated for the HP Indigo 30000, a sheet-fed press designed to print on folding cartons. Michelman’s DigiPrime 060 is designed to enhance ink adhesion on the substrate, and will not interfere with converting operations including erection of the carton, gluing, date coding and bar coding.

Michelman offers a full line of primers and overprint varnishes formulated to allow HP Indigo users to get the most out of their presses. DigiPrime and Michem® In-Line primers are HP-recommended and improve ink receptivity, rub resistance and image quality on most types of paper, plastic and film. DigiGuard® overprint varnish enhances print quality and protects printed materials.

About Michelman
Michelman is a global developer of water-based barrier and functional coatings for flexible film packaging, paperboard, and corrugated cartons; and water-based surface modifiers, additives and polymers for numerous industries including wood and floor care, industrial coatings, inks, fibers, composites, and construction products. Michelman serves its multinational and regional customers with production facilities in the U.S., Europe and Singapore, and a worldwide network of highly trained field technical support personnel.